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胡单辉, 林倩, 邬海峰, 陈思维, 王晓政, 贾立宁. 半导体技术发展趋势探究——以射频功率放大器为例[J]. 桂林电子科技大学学报, 2023, 43(4): 271-281.
引用本文: 胡单辉, 林倩, 邬海峰, 陈思维, 王晓政, 贾立宁. 半导体技术发展趋势探究——以射频功率放大器为例[J]. 桂林电子科技大学学报, 2023, 43(4): 271-281.
HU Danhui, LIN Qian, WU Haifeng, CHEN Siwei, WANG Xiaozheng, JIA Lining. Research on the development trend of semiconductor technology: take the RF power amplifier as an example[J]. Journal of Guilin University of Electronic Technology, 2023, 43(4): 271-281.
Citation: HU Danhui, LIN Qian, WU Haifeng, CHEN Siwei, WANG Xiaozheng, JIA Lining. Research on the development trend of semiconductor technology: take the RF power amplifier as an example[J]. Journal of Guilin University of Electronic Technology, 2023, 43(4): 271-281.

半导体技术发展趋势探究——以射频功率放大器为例

Research on the development trend of semiconductor technology: take the RF power amplifier as an example

  • 摘要: 在分析射频功率放大器(RF PA)的半导体材料、芯片研究现状基础上,总结了半导体技术的发展趋势。通过对半导体材料的特性和PA芯片的性能指标进行分析,发现三代半导体材料皆有优缺点,可根据需要将其分别应用在不同场景,实现共同进步、协调发展。随着PA芯片面积逐渐减小、频率不断增大,对第三代半导体材料和硅基合成材料功放的研究将是未来的热点。为了进一步加快PA的研究进程,通过文献调研总结了半导体技术的5个发展趋势,为RF PA的性能提升和技术发展提供了重要参考,可为我国突破国外厂商壁垒,进一步提升在电子信息、芯片研发领域的核心竞争力奠定一定基础。

     

    Abstract: Based on the analysis of radio frequency power amplifier (RF PA) semiconductor materials and chip research status, the development trend of semiconductor technology is summarized. Through the analysis of the characteristics of semiconductor materials and the performance indicators of PA chips, it is found that three generations of semiconductor materials have advantages and disadvantages, which can be applied in different scenarios according to the needs to achieve common progress and coordinated development. With the gradual reduction of PA chip area and increasing frequency, the research on third-generation semiconductor materials and silicon-based composite power amplifiers will be a hot spot in the future. In order to further accelerate the research process of PA, 5 development trends of semiconductor technology are summarized through literature research, which provides an important reference for the performance improvement and technological development of RF PA, which can help our country break through the barriers of foreign manufacturers and further enhance the core competitiveness in the field of electronic information and chip research development, and lay a certain foundation.

     

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