Abstract: The development of integrated circuits requires materials with low dielectric constant materials, and the dielectric constant of polymers can be reduced by adding nanocavity materials in. Polyimide (PI) synthesized by 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA) and 4,4′-diaminodiphenyl ether (ODA) was used as the matrix, and ZIF-67 and OPS were introduced as nano-fillers to prepare ZIF-67/PI, OPS/PI, and OPS/ZIF-67/PI composite films. The ZIF-67 and the above three composite films were characterized by Fourier transform infrared spectroscopy, scanning electron microscopy and X-ray diffractometer to study the effects of the contents of ZIF-67 and OPS on the thermal stability and dielectric properties of the composite films. The experimental results showed that the thermal stability of OPS/ZIF-67/PI composite films decreased compared with that of PI when a certain mass fraction of ZIF-67 and OPS were added, but their decomposition temperature was still greater than 440 ℃, which had good thermal stability; the dielectric constant of OPS/ZIF-67/PI composite films was lower than that of pure PI films when the mass fraction of OPS was When the mass fraction of OPS is 5% and the mass fraction of ZIF-67 is 7%, the dielectric constant of OPS/ZIF-67/PI composite film is 0.69 (1 kHz), which is 58.2% lower than the dielectric constant of ZIF-67/PI composite film with 7% ZIF-67 addition (1.65, 1 kHz), and the dielectric constant of OPS/PI composite film with 5% OPS addition is 58.2% lower than the dielectric constant of ZIF-67/PI composite film with 7% ZIF-67 addition. The dielectric constant of the composite film (2.52, 1 kHz) decreased by 72.6% relative to that of the pure PI (2.98, 1 kHz), and by 76.8% relative to that of the pure PI (2.98, 1 kHz). The dielectric loss of the composite films increased slightly when a certain mass fraction of OPS with ZIF-67 was added.