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刘成明, 陈鹏, 李宇帆, 等. 一种非接触高速互连组件的仿真研究J. 桂林电子科技大学学报, xxxx, x(x): 1-10. DOI: 10.16725/j.1673-808X.2025278
引用本文: 刘成明, 陈鹏, 李宇帆, 等. 一种非接触高速互连组件的仿真研究J. 桂林电子科技大学学报, xxxx, x(x): 1-10. DOI: 10.16725/j.1673-808X.2025278
Liu Chengming, Chen Peng, Li Yufan, et al. Simulation of a non-contact high-speed interconnection componentJ. Journal of Guilin University of Electronic Technology, xxxx, x(x): 1-10. DOI: 10.16725/j.1673-808X.2025278
Citation: Liu Chengming, Chen Peng, Li Yufan, et al. Simulation of a non-contact high-speed interconnection componentJ. Journal of Guilin University of Electronic Technology, xxxx, x(x): 1-10. DOI: 10.16725/j.1673-808X.2025278

一种非接触高速互连组件的仿真研究

Simulation of a non-contact high-speed interconnection component

  • 摘要: 针对传统电缆互连及连接器存在体积偏大、装配不便、浮动容差小、分离可靠性低、服役寿命受限等工程问题,提出一种非接触式一体化互连方案。该互连组件由成对端机构成,可替代传统物理插接式连接器,兼具大浮动容差、自主自由分离优势,可同步实现无线电能耦合传输与无线数据通信功能。本文配套设计3款电磁功能组件:选用100 kHz平面螺旋线圈作为磁耦合传能单元,分别设计2.5 GHz折叠V型PIFA通信天线、60 GHz高增益开口波导天线。依托电磁仿真模型,系统探究同频天线自串扰、异频天线互串扰特性,重点分析低频传能线圈分别与2.5 GHz、60 GHz通信天线的电磁干扰,以及两类通信天线间的耦合干扰规律,评估多天线协同工作下的电磁串扰水平。基于100 kHz磁耦合谐振原理开展无线电能传输设计,借助ANSYS Maxwell完成线圈结构参数优化,耦合间距1 cm、3 cm工况下,电能传输效率分别可达99.97%、98.91%;采用多模态射频传输架构实现数据交互,其中2.5 GHz折叠V型PIFA天线阻抗带宽为290 MHz(2.38~2.67 GHz),峰值增益3.4 dBi,60 GHz开口波导天线带宽8 GHz、峰值增益7.65 dBi,可适配多速率总线数据传输场景。CST电磁串扰仿真结果表明,2.5 GHz天线、60 GHz天线与传能线圈之间,异单元隔离度基本低于-60 dB,系统电磁串扰程度微弱,多单元可稳定协同工作。

     

    Abstract: Aiming at the inherent drawbacks of conventional cable and connector assemblies, such as bulky physical dimensions, cumbersome installation procedures, limited axial and radial misalignment tolerance, high risk of accidental disconnection, and restricted service life, this work proposes a non-contact interconnection scheme as an alternative solution. The proposed assembly consists of a pair of transceivers designed for paired operation, which can fully replace traditional mechanical connectors. It features enhanced floating tolerance and free non-contact disconnection capability, integrating both wireless power transfer and high-speed wireless data transmission functionalities.Three types of microwave and electromagnetic components are designed in this study. Specifically, a planar spiral coil operating at 100 kHz is developed for wireless power delivery, while a 2.5 GHz PIFA antenna and a 60 GHz high-gain antenna are designed for wireless data communication. On the basis of the established antenna simulation models, the mutual crosstalk between different antennas as well as the self-interference between identical antennas is systematically investigated. The research includes the analysis of electromagnetic interference between the power transfer coil and the 2.5 GHz/60 GHz data antennas, the mutual interference between the 2.5 GHz and 60 GHz antennas, as well as the co-channel interference between homogeneous 2.5 GHz antennas or 60 GHz antennas. The intensity of mutual crosstalk among the three types of components operating simultaneously is quantitatively evaluated, and corresponding results are analyzed in detail.Wireless power transfer is realized based on 100 kHz magnetically coupled resonant technology. Parameter optimization of the power transfer coil is performed via ANSYS Maxwell simulation. The transmission efficiency reaches 99.97% at a 1 cm gap and 98.91% at a 3 cm gap respectively. For data transmission, a multi-modal communication strategy is adopted. The designed 2.5 GHz V-shaped folded PIFA antenna achieves an impedance bandwidth of 290 MHz ranging from 2.38 GHz to 2.67 GHz, with a peak gain of 3.4 dBi. The 60 GHz open-ended waveguide antenna exhibits a bandwidth of 8 GHz and a gain of 7.65 dBi, which can satisfy the transmission requirements of various high-speed bus interfaces with different data rates.In addition, system-level electromagnetic crosstalk is analyzed using CST simulation. The results demonstrate that the isolation levels between the 2.5 GHz antenna and the 60 GHz antenna, as well as between the data antennas and the power transfer coil, are mostly below -60 dB, indicating extremely weak crosstalk and satisfactory electromagnetic compatibility within the integrated non-contact interconnection system.

     

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