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秦红波, 汪健. 不同质量分数Ni3Sn4颗粒添加的Sn58Bi复合钎料应力−应变关系研究J. 桂林电子科技大学学报, 2026, 46(2): 186-194. DOI: 10.16725/j.1673-808X.202351
引用本文: 秦红波, 汪健. 不同质量分数Ni3Sn4颗粒添加的Sn58Bi复合钎料应力−应变关系研究J. 桂林电子科技大学学报, 2026, 46(2): 186-194. DOI: 10.16725/j.1673-808X.202351
QIN Hongbo, WANG Jian. Study on stress-strain relationship of Sn58Bi composite filler metal with different mass fraction Ni3Sn4 particlesJ. Journal of Guilin University of Electronic Technology, 2026, 46(2): 186-194. DOI: 10.16725/j.1673-808X.202351
Citation: QIN Hongbo, WANG Jian. Study on stress-strain relationship of Sn58Bi composite filler metal with different mass fraction Ni3Sn4 particlesJ. Journal of Guilin University of Electronic Technology, 2026, 46(2): 186-194. DOI: 10.16725/j.1673-808X.202351

不同质量分数Ni3Sn4颗粒添加的Sn58Bi复合钎料应力−应变关系研究

Study on stress-strain relationship of Sn58Bi composite filler metal with different mass fraction Ni3Sn4 particles

  • 摘要: 由于尺寸效应的存在,大尺寸材料的拉伸和剪切等力学测试已经不能满足微米级别焊点的力学行为研究。纳米压痕技术作为一种先进的力学无损检测方法,可以表征材料的微观力学行为,通过载荷位移曲线可以得到微区弹性模量和硬度等参数,然而无法直接得到材料的力学本构关系。通过向Sn58Bi焊膏中添加Ni3Sn4颗粒,利用纳米压痕实验和有限元仿真相结合的方法,得到4种质量分数Ni3Sn4(0、0.3%、0.5%和1.0%)复合材料的非线性应力−应变本构方程。纳米压痕实验结果表明,随着Ni3Sn4含量的增加,弹性模量和硬度呈先减后增的趋势;反演分析结果表明,添加Ni3Sn4颗粒比未添加得到的屈服强度高。

     

    Abstract: As an advanced mechanical nondestructive testing method, nanoindentation technology can characterize the micromechanical behavior of materials. Parameters such as micro-elastic modulus and hardness can be obtained from the load displacement curve, but the mechanical constitutive relationship of materials cannot be obtained directly. In this paper, by adding Ni3Sn4 particles into Sn58Bi solder paste, the nonlinear stress-strain constitutive equations of four kinds of composite with Ni3Sn4(0, 0.3%, 0.5% and 1.0%) composites were obtained by means of the nanoindentation test and finite element simulation. The results of the nanoindentation test show that the elastic modulus and hardness decrease first and then increase with the increase of Ni3Sn4 content. The results of inversion analysis show that the yield strength obtained by adding Ni3Sn4 particles is higher than that without adding Ni3Sn4 particles.

     

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